Thermal Shock Testing

Thermal shock testing offered at Micom Laboratories. We can perform thermal shock testing on components weighing up to 80 lbs. Our thermal shock testing chamber allows the automatic transfer of your components from a cabinet that can go from -75° C to a second cabinet that can be as warm as +200° C and all in the span of 20 seconds. This allows testing multiple units simultaneously and minimizing your overall material testing costs.

Uses and factors to be considered

Thermal shock testing chambers are used for Environmental Stress Screening (ESS) and Highly Accelerated Life Testing (HALT). This type of testing is used by the micro-electronic and electrical industries, telecom, automotive and aerospace industry to do accelerated aging of their components. We can test according to MIL-STD-810, Telcordia, MIL-STD 883, MIL-STD 202, SAE J1455 and many other standards.

Typical experimental parameters of thermal shock testing

  • Payload mass:                                         TBD
  • Number of temperature stages:          2 or 3
  • Temperature stages:                              between -78° C and 200° C
  • Dwell time at each temperature:        TBD
  • Number of test cycles:                          TBD

Other related test methods

To learn more about thermal shock testing, we invite you to read more about Climatic Chamber, Test Chamber Testing and Accelerated Aging.

If you have any questions regarding our thermal shock test services, we invite you to contact us today. It will be our pleasure to answer your questions and review your custom testing requirements.

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